Hierarchy view
slice crystals into wafers
Description
Description
Operate wire saw machines to slice the silicon crystals into ultra thin wafers of approximately 2/3 millimeters thick.
Alternative Labels
crystal slicing to make wafers
operate wire saw machines
operating wire saw machines
slicing crystals into wafers
wire saw machine operating
wire saw machines operating
Skill type
skill
Skill reusability level
occupation specific skills and competences
Relationships
Broader concepts
Essential for
Concept URI
Status
released