Skip to main content
There is a temporary issue on this page. Please, try later. We apologise for this inconvenience.

Show filters

Hide filters

Filters

Hierarchy view

slice crystals into wafers

Description

Description

Operate wire saw machines to slice the silicon crystals into ultra thin wafers of approximately 2/3 millimeters thick.

Alternative Labels

crystal slicing to make wafers

operate wire saw machines

operating wire saw machines

slicing crystals into wafers

wire saw machine operating

wire saw machines operating