Hierarchy view
assemble microelectromechanical systems
Description
Description
Build microelectromechanical systems (MEMS) using microscopes, tweezers, or pick-and-place robots. Slice substrates from single wafers and bond components onto the wafer surface through soldering and bonding techniques, such as eutectic soldering and silicon fusion bonding (SFB). Bond the wires through special wire bonding techniques such as thermocompression bonding, and hermetically seal the system or device through mechanical sealing techniques or micro shells. Seal and encapsulate the MEMS in vacuum.
Alternative Labels
assemble MEMS
assemble microelectromechanical systems
assembling MEMS
assembling microelectromechanical systems
assembling microsystems
MEMS assembling
microelectromechanical system assembling
microelectromechanical systems assembling
microsystems assembling
Skill type
skill
Skill reusability level
sector specific skills and competences
Relationships
Narrower skills
Essential for
Optional for
Optional Knowledge
Concept URI
Status
released
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